Researchers led by Australia’s Commonwealth Scientific and Industrial Research Organisation (CSIRO) recorded an 11% efficiency on 50 cm² large-scale solar panels consisting of optimized roll-to-roll fabricated hybrid perovskite solar cells.
In a new weekly update for pv magazine, OPIS, a Dow Jones company, offers bite-sized analysis on solar PV module supply and price trends.
China’s SolarSpace has partnered with NTPC to provide dual-glass PV modules for NTPC’s 375 MW solar project in Bhuj, Gujarat, with Zetwerk as the supply partner.
China’s OSDA has introduced TOPCon bifacial modules with power outputs ranging from 590 Wp to 630 Wp and efficiencies up to 22.54% in India.
Researchers in Bangladesh have designed a dual-junction tandem solar cell with a bottom device based on iron disilicide (FeSi2), an emerging absorber material know for its high thermal stability and good optoelectronic properties. Their simulation showed the advantage of combining the larger bandgap of the top cadmium telluride cell and the smaller bandgap of the bottom FeSi2 cell.
Silicon-perovskite tandem solar requires optimization of both approaches, and embodies the weaknesses of each. Meanwhile, the use of pure thin-film devices offers a cheaper, simpler, and more sustainable PV solution for the United States.
Solar manufacturers now have until March 26 to bid for domestic manufacturing and supply of solar modules with made-in-India PV cells.
The Chinese panel manufacturer said its new products have a temperature coefficient of -0.28%/C and a power output ranging from 565 W to 590 W. They rely on the company’s proprietary hybrid passivated back contact (HPBC) cell technology.
Jolywood has suspended plans to build 100,000 metric tons (MT) of polysilicon capacity at a facility in Gujiao, China’s Shanxi province.
The researchers simulated an all perovskite solar cell offering the advantage of effectively harnessing sunlight across a wide range of wavelengths. The device has the potential to achieve an open-circuit voltage of 3.76 V, a short-circuit density of 10.70 mA/cm², and a fill factor of 69.00%.
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